Thermally Conductive Electrically Insulating Potting Compound

5108 is a self leveling material that exhibits low shrinkage once cured and can withstand high temperatures and high humidity or wet environments.

Thermally conductive electrically insulating potting compound.

Flexible low viscosity thermally conductive epoxy. This flexible system is designed for low stress on sensitive components during and after cure. Durapot 866 is a 500ºf thermally and electrically insulating compound. Meets nasa low outgassing specifications.

500 f thermally insulating potting compound. Serviceable from 60 f to 250 f. This product is designed for applications where thermal management is a concern. A one part black electrically isolating epoxy compound specifically designed for potting and sealing electronic components.

Lord corporation has been supplying thermally conductive electrically insulating potting materials to the power electronics industry for over a decade and recently we have been testing the effectiveness of using potting compounds with high thermal conductivity to dissipate heat in high power applications. Outstanding heat dissipative properties. Forms a low density non porous foam for high temp applications. Convenient two part room temp curing system.

832tc potting and encapsulating compound is a thermally conductive black two part epoxy that offers extreme environmental mechanical and physical protection for printed circuit boards and electronic assemblies. 50 2366fr polyurethane resin system is formulated for applications requiring low exotherm low shrinkage and excellent electrical properties. Thermal conductive electrically insulative epoxy cures at room temperature.